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@Sean and Henry Here is SWAN parts 3d modeling changed data T1(DVT1&2) and new T0 (DVT3). - Housing Top, Bottom, etc.. if you have any question for mechanical design, please ask me. I will update assembled 3d modeling data to you soon. Thanks SON |
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Hi Henry Here is 3d modeling data base line for DVT3 Thanks SON |
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Hi, SH reply 0001143:0006441 Please check the attached 3D data of the all PCB and heat spreader. And I'm updating the cable routing, will upload to you soon. Thanks Jim screw hole.PNG (41,307 bytes) screw hole-1.PNG (11,332 bytes) |
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Hi, SH 0006457 Please add 2mm on screw hole, so that we can also assembly the SoC board with DVT1 heat spreader samples. Thanks Jim |
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Hi, SH Here is assembly issue for DVT3 3D data. And after modified the bottom cover, we have to change the SoC bottom heat spreader and Soc top heat spreader. So that we can not use the DVT1 samples. Please help to confirm. Thanks Jim |
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Hi SH, I have 2 questions about the 3D drawing 1. Is it possible to follow our ME's advice? Otherwise we will need to scrap the heatspreader purchased previously before DVT, which will cause more E&O cost for ALT. 2. May I use this 3D modeling to review the package? The dimension should be fixed right? Thanks Henry |
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HI Henry Reply 0001171:0006463 1. Check with Inkel and upate to you. but the It seem not easy because it's an aggressive schedule. 2. No problem. dimension is fixed. Hi Jim reply 0001171:0006462 we will review and feedback to you soon. Thanks SON |
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Hi Jim reply 0001171:0006462 here is feedback for your DVT3 review report. if you have any question, please let me know Thanks SON |
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Hi Jim here is updated 3d data 0001171:0006482 Please check and let us know any issue Thanks SON |
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@Sean and Henry Here is 3d modeling data. this data used for DVT3 T0 tooling. if you have any question, please ask us. Thanks SON |
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Hi, SH After re-layout the MIC PCB, we moved the label to the top side. But some of the components move and interfere with SILICON_MIC. So need to modify the SILICON_MIC to avoid those components. Please find the attached 3D data of MIC PCB and SILICON_MIC. Jim MIC PCB.PNG (163,168 bytes) |
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@Henry Here is assembly guide for DVT3 housing. Please find the attachment file. And Mechanical Improvement for Acoustic Noise is same as DVT2. - https://mantis.cnsbg.foxconn.com/vaas/view.php?id=1051 if you have any question, please let me know. Thansk SON |
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Hi Jim, Plz help review the SOP quickly. We will need to upload the manufacturing documents within this week. Thanks Henry |
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Hi Henry and Jim Please update the final heat spreader modeling data as we confirmed 0001101:0006970 Thanks SON |
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Hi, SH Please find the attached 3D modeling of heat spreader and inductors changed. And please confirm if the new e-cap needs to some glue. Jim new e-cap.PNG (83,124 bytes) |
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Hi Jim. the Ecap of New amp board, no need to apply the glue. because this ecap is SMT type, It will fixed without gap. about modeling data, I will feedback to you soon Thanks SON |
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Hi SH, For the heatspreader that would be impacted by the chosen IND by ALT, plz check carefully. Once the tooling starts, there will be modification cost incurred if any design change request from ALT later. We will wait for your confirmation to inform the vendor of tolling start. Thanks, Henry |
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(PM) Henry Chiou 0001171:0006991 ALT can confirm the check modeling data and DVT3 sample. Please check the tooling start dead line for MP Thanks SON |
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Hi, SH Please find the attached updated 3D modeling of heat spreader for inductors changed. if you have any question, please let me know. Thansk Jim |
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Hi SH, We should notify the vendor to start tooling this week. It takes 5 WKs for tooling and another 2 WKs for production... For 100pcs demand we can manage but for the demand after we will not be able to solve the capacity and cost issues if we don't have the tooling ready quickly... Thanks Henry |
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HI Jim and Henry 0001171:0007022 Checked modeling data, it is last thermal test conditions heat spreader 3d modeling data 0001101:0006916 According to the FII tested result, it seems to be no problem for thermal solution but FII has the role of thermal solutions, So, FII makes a decision to start tooling Thanks SON |
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Hi, SH I have received the housing samples, but there are some inconsistencies between the samples and 3D modeling. Please help to confirm. Thanks Jim |
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HI Jim 0001171:0007060 Here is T0 review result from inkel 3d modeling data is correct. : Woofer area is under rework by inkel VN factory. it can be assembly. the others items will have no problem with assembly. If you have any question or problem, pleas contact me. Thanks SON |
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Hi, SH Thanks for your confirmation, we will ask the factory to pay attention to the assembly issues that occur in DVT2. Thanks Jim |
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Hi Jim Here is DVT3 Speaker assembly notice. Please check and apply your SOP Thank SON |
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Hi, SH Please find the attached 3D modeling of heat spreader base on final thermal simulation. Please check and let us know any issue. We will start the tooling with this 3D modeling if you don't have problem with it. Jim |
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Hi, SH Please find the attached updated 3D modeling of heat spreader. Thanks Jim |
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Hi Jim. As we discussed before, the side led bushing should be completely closed like speaker cable bushing. last talk to Henry, ALT was introduced FFC vender can make completely closed FFC cable. So, Please let us know the update side led bushing status, if the FFC with bushing design is done, Send me the datasheet and drawings. Thanks SON Side LED Bushing.png (35,075 bytes) |
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Hi, SH 0001171:0007122 We are confirming with the supplier, and will send the datasheet to you soon. Thanks Jim |
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Hi, Sean As I mentioned to e-mail, bottom vent will delete at next version. Best regards Lonnie Kim |
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HI Jim ALT and Inkel is under review for the update mic bracket screw boss. please see the attached concept "mic bracket" I think the heat spreader_amp_bot open the screw hole "red area" will be no problem. So, please update heat spreader_amp_bot design. I will update T1 modeling data soon Thanks SON heat spreader_amp_bot.png (42,021 bytes) mic bracket.png (21,547 bytes) |
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Hi, SH Please find the attached updated 3D modeling of heat spreader. Please confirm whether we can continue the tooling with this 3D modeling. Thanks Jim |
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Hi Jim Reply 0001171:0007169 Please continue the tooling with this 3D modeling data. it will be no problem for final assembly. also, note that the screw boss will be move to 11mm from currently location I will update to you soon 3d modeling data after updated. Thanks SON housing.png (66,637 bytes) |
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HI Jim. Please refer to the top housing drawings. as ALT and Inkel review the move the screw boss of MIC holder 0001171:0007167 , It can not moved due to mold EJECT PIN area. you can find the top housing sample(DVT3, T0), so, we will add the rib around screw boss. if you have any question, please contact me. Thanks SON |
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Hi, SH OK, we will review and feedback to you soon. Thanks Jim |
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@Dennis here is feedback as your IQC abnormal if you have any question, please ask using this mantis Thanks SON |
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Hi SH, 1. As discussed before, GASKET_A & GASKET_B which pasted on the BRACKET SIDE LED will paste on the bracket by vendor. Did you inform that to vendor? 2. About GASKET CASE TOP (10x300mm), our factory need to cut for the last 0.5 pcs, will you update the dimension? 3. We need to add gasket on the speaker cable connector, will you add a new gasket (10x150mm) for us? Or we need to use GASKET CASE TOP (10x300mm), but our factory need to cut it in half for each connector, which will increase the cost of labor. Thanks Jim |
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Hi Jim Chen 0001171:0007690 I will check with vender and feedback to you soon Thanks SON |
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Hi SH, Please kindly check if there is any further action needed for this issue? If no, then please help to close this issue. Thanks! Regards, Sean |
- yk.jung ( (ALTech) Younkwang Jung ) developer
